Printed Circuit Board

Low or high volume, prototype or established product, ITL is able to accommodate your requirements with our flexible systems.

Surface Mount

ITL’s SMT facility offers maximum flexibility regardless of batch quantity resulting in fast turnaround for PCBs.

SpeedPrint Technology SP200avi Screen Printer

This system offers high performance semiautomatic screen printing with an automatic vision alignment system ensuring high reliability.

The advanced vision overlay system will inhibit a print cycle until the board is fully aligned. The system has ultra-fine pitch accuracy of +/- 0.3mm.

Europlacer Progress 6

As our main SMT assembly, the system uses "on-the-fly vision" for placement accuracy. The system is capable of maintaining 6000 placements per hour with a component range of 0402 to 50 mm 2.

The accuracy of the system is complemented by 198 x 8mm feeders, enabling a vast inventory of component types to be available at any time.

YesTech AOI B2 Optical Inspection Station

This automated Optical Inspection system is yet more proof of our continual investment in quality. The automated system allows fast inspection of multiple parameters for each board component.

SMT / Visual Inspection

With Vision Engineering's Cobra and Mantis microscopes, we are able to offer process and final inspection of all SMT PCBs.

Heller 1707 EXL Reflow Oven

ITL is lead free and our investment in a new reflow oven is just one of the steps we have taken to show our commitment to change.

The oven’s full-forced convection heating technology eliminates all component hot spots, out-performing infrared systems.

PTH Semi-Auto

This light-guided system ensures consistent repeatable production of PCB assemblies.

Blakell LS920 semi-automatic insertion machine

With our range of semi-automatic machines we have the flexibility to assemble a wide range of boards. This process also has the benefit of "cut & clinch". This streamlines the process by simplifying component prepping and eliminates post-insertion lead trimming. Component retention greatly improves first-pass yields by improving solderability.